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Total Cu coverage from Cu(hfac)2 deposition on Si(111)-7×7 at room temperature using HIBS

C. IONESCU1,* , M. A. IONESCU1, I. CIUCA1

Affiliation

  1. Faculty of Science and Materials Engineering, Politechnical University of Bucharest, Romania, UE

Abstract

UPS, STM, XPS, and HIBS were performed to study initial stages of nucleation of Cu deposited from Cu(hfac)2 via chemical vapor deposition (CVD) on clean Si(111)-7x7 surface. At room temperature Cu binds to the substrate mostly by Cu(I) as demonstrated by the absence of shake-up features in the XPS spectra. HIBS using 12C3+ was performed in order to obtain the total Cu coverage (Cu atoms/cm2). The coverages are not linearly related to the apparent exposures..

Keywords

Cu/Si(111), HIBS.

Citation

C. IONESCU, M. A. IONESCU, I. CIUCA, Total Cu coverage from Cu(hfac)2 deposition on Si(111)-7×7 at room temperature using HIBS, Optoelectronics and Advanced Materials - Rapid Communications, 6, 1-2, January-February 2012, pp.266-268 (2012).

Submitted at: Dec. 8, 2011

Accepted at: Feb. 20, 2012