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The effects of eutectic force to interconnect characteristics and thermal performances of HP LED

LUQIAO YIN1,2,* , JINLONG ZHANG1,2, YANG BAI1, WEIQIAO YANG3, JIANHUA ZHANG1,2,*

Affiliation

  1. Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Education, Shanghai, China 200072
  2. School of Mechatronics and Automation, Shanghai University, Shanghai, China 200072
  3. Shanghai Research Center of Engineering and Technology for Semiconductor Lighting. Shanghai China 201203, P.O.B 143, 149 Yanchang Rd., China

Abstract

Heat dissipation is regarded as the key issue for high power light emitting diode (HP LED packaging. Silver paste can hardly dissipate the heat effectively for its low thermal conductivity coefficient. Though the eutectic proces ses are complicated, eutectic interconnect is an effective way to improve the heat dissipation. The e ffects of e utectic force to i nterconnect c haracteristics and t hermal p erformances of HP LED are investigated in this paper. The optical and thermal perform ances of the HP LED interconnected with different eutectic force are tested and analyzed. The results show that the eutectic force is indeed needed to improve the thermal and optical performances.

Keywords

HP-LED, Eutectic interconnect, Eutectic force, Junction temperature.

Citation

LUQIAO YIN, JINLONG ZHANG, YANG BAI, WEIQIAO YANG, JIANHUA ZHANG, The effects of eutectic force to interconnect characteristics and thermal performances of HP LED, Optoelectronics and Advanced Materials - Rapid Communications, 8, 5-6, May-June 2014, pp.427-431 (2014).

Submitted at: Aug. 9, 2013

Accepted at: May 15, 2014