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R. P. SHARMA1,* , P. K. KHANNA2, D. KUMAR1
Fabrication of mechanically stable interconnections on chip and micro-systems, applicable in hazardous environment, is the main objective of the device packaging techniques. Isothermal solidification based interconnection technique offers possibility of obtaining high mechanical stability of bonding. Seal rings, commonly fabricated at input opening of sensors, are developed using Sn interlayer metal. Effects of temperature, reaction time, pressure, thickness and geometry on the ultimate tensile strength (UTS), ultimate shear strength (USS) and ultimate torsional strength values are analyzed and reported..
Isothermal solidification, Seal ring, Ultimate shear strength (USS), Ultimate tensile strength (UTS) and ultimate torsional strength.
R. P. SHARMA, P. K. KHANNA, D. KUMAR, Mechanical properties of Ag-Ni seal rings for micro-systems, Optoelectronics and Advanced Materials - Rapid Communications, 3, 12, December 2009, pp.1375-1378 (2009).
Submitted at: Nov. 19, 2009
Accepted at: Nov. 23, 2009
Optoelectronics and Advanced Materials - Rapid Communications
(2023): 0.5 - 2023 Journal Citation Reports (Clarivate Analytics, 2024)
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