Abstract
We report on the influence of annealing on the electrical and structural properties of Pd/n-GaN Schottky diode by currentvoltage
(I-V), capacitance-voltage (C-V), X-Ray diffraction (XRD) and Auger electron spectroscopy (AES) measurements.
The Schottky barrier height of the as-deposited Pd/n-GaN was found to be 0.80 eV (I-V) and 1.32 eV (C-V). However, both
measurements indicate that the barrier height slightly increases to 0.87 eV (I-V) and 1.44 eV (C-V) upon annealing at
300 °C for 1 min in nitrogen gas. After annealing at 400 °C, the Schottky barrier height slightly decreases to 0.79 eV (I-V)
and 1.42 eV (C-V). Further, with an increase in annealing temperature up to 500 °C; the barrier height is decreased to
0.74 eV (I-V) and 1.33 eV (C-V). Based on the Auger electron microscopy and X-ray diffraction results, the formation of
gallide phases at the Pd/n-GaN interface could be the reason for the improvement of electrical properties of Schottky
contact upon annealing at 300 °C.
Keywords
Electrical and structural properties, Pd/n-GaN Schottky diode, Auger electron microscopy, X-ray diffraction.
Citation
K. JAGADESWARA REDDY, V. RAJAGOPAL REDDY, P. NARASIMHA REDDY, K. S. R. KOTESWARA RAO, Effects of thermal annealing on electrical and structural characteristics of Pd/n-GaN Schottky diode, Optoelectronics and Advanced Materials - Rapid Communications, 1, 3, March 2007, pp.91-95 (2007).
Submitted at: Feb. 2, 2007
Accepted at: Feb. 14, 2007