Abstract
A series of Ta(5nm)/Ni 81 Fe 19 (20 nm)/Ta(3nm) and (Ni 81 Fe 19 1 x Cr x (5nm)/Ni 81 Fe 19 (20nm)/Ta(3nm) Ni 81 Fe 19 magnetic ultra thin
films were prepared by magnetron sputtering method under different temperature. Effects of substrate temperature and
buffer layer on the anisotropic magnetoresi stance (AMR) of Ni81 Fe19 thin films had been investigated The grain size and
grain orientation were analyzed by X ray diffraction. AMR value of Ni81 Fe19 ultra thin films were measured by Four point
probe technology. The buffer layer of Cr atoms in the per centage content was determined by EDS Surface morphology of
the samples was measured by AFM The results showed that Substrate temperature and buffer layer have significant effects
on anisotropic magnetoresistance. With the rise of substrate temperature, AMR value increases increases. The Ni 81 Fe 19 films were
prepar ed at the substrate temperature of 400 shows the highest AMR value. When the substrate temperatures are higher
than 400 ℃, as the substrate temperature gets up, the values become stable. With the buffer layer thickness increased, AMR values go up. It has a topped peak 3.67% when the thickness reaches 4nm. Once the thickness is greater than 4nm, AMR values decrease. The AMR value of Ni 81 Fe19Ultra thin Films with NiFeCr as the buffer layer was significantly greater than the
samples with Ta as the buffer layer When the thickness of Ni81Fe19Cr buffer layer is about 4nm and the buffer layer of Cr
atoms in the percentage content is 32% the maximum anisotropic magnetoresistance (AMR) value reaches 3.67% and the
maximum grain size is 23.1nm..
Keywords
Ni81Fe19 thin films, Buffer layer, Ultra-thin, Anisotropic magnetoresistance, Magnetron sputtering.
Citation
JIAN FANG HE, SHU YUN WANG, Effects of substrate temperature and buffer layer on the anisotropic magnetoresistance of Ni81 Fe19 ultra thin films, Optoelectronics and Advanced Materials - Rapid Communications, 6, 1-2, January-February 2012, pp.165-168 (2012).
Submitted at: Dec. 15, 2011
Accepted at: Feb. 20, 2012