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T. ZENG1, K. TANG2,* , D. ZHU1,* , C. YANG1, P. CHEN1
The effect of solid solution and aging treatment on mechanical performance, electrical and thermal conductivity of hot-extruded Cu-Te-Li alloys is studied via DDL100 electronic universal machine, MVC-100A1 hardness tester, SB2230 digital electric bridge and DRPL-I coefficient of thermal conductivity instrument. The microstructures of Cu-Te-Li alloys after different processing are observed by CMM-20 metallographic microscope. The results showed that deformed microstructure of Cu-Te-Li alloy sticks disappeared and Te element precipitated as a second phase of Cu2Te after solid solution and aging treatment. With Te content increasing, the tensile strength and hardness increase, while the electrical and thermal conductivity declines within a small range. When the content of Te reached 0.505%, the tensile strength and hardness of Cu-Te-Li alloy sticks after aging treatment increase by 21.6% and 28.5%, while the electrical and thermal conductivity decrease by 5.45% and 3.89% compared with that of pure copper respectively..
Cu-Te-Li alloys, Mechanical performance, Electrical conductivity, Thermal conductivity, Microstructure.
T. ZENG, K. TANG, D. ZHU, C. YANG, P. CHEN, Effect of solid solution and aging treatment on the microstructures and properties of hot-extruded Cu-Te-Li alloys, Optoelectronics and Advanced Materials - Rapid Communications, 8, 5-6, May-June 2014, pp.495-499 (2014).
Submitted at: Sept. 13, 2013
Accepted at: May 15, 2014
Optoelectronics and Advanced Materials - Rapid Communications
(2022): 0.5 - 2022 Journal Citation Reports (Clarivate Analytics, 2023)
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