Abstract
In this work, the structure of the InN films has been determined by means of conventional XRD phase analysis ω/2θ scan.
Characteristics of the as-deposited (Ni, Ag, and Ni/Ag) metal contact on indium nitride (InN) have been studied. Specific
contact resistivity, ρc (SCR) was determined using transmission line method (TLM). The bilayer contact produced the lowest
SCR. For this reason, different annealing temperatures (400 °C-700 °C) in nitrogen gas ambient and durations (1-30
minutes) are investigated for Ni/Ag metal contacts, as thermally stable metal-semiconductor contacts are essential for high
quality devices. Annealing in nitrogen gas ambient is believed to avoid nitrogen vacancies which act as donors. The
electrical behavior of each condition is compared. For relatively different annealing temperatures, substantial difference of
the SCR values is observed between different durations samples. Scanning electron microscopy (SEM) measurements
were carried out on the as-deposited, and annealed contacts where the surface morphology of each of these conditions
was compared.
Keywords
Specific contact resistivity, Indium nitride, Ohmic contact, Annealing.
Citation
L. S. CHUAH, Z. HASSAN, H. ABU HASSAN, Comparative study of characteristics in Ni, Ag and Ni/Ag metal contact schemes on n-type InN layer, Optoelectronics and Advanced Materials - Rapid Communications, 1, 10, October 2007, pp.523-527 (2007).
Submitted at: Aug. 8, 2007
Accepted at: Aug. 30, 2007