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Comparative study of characteristics in Ni, Ag and Ni/Ag metal contact schemes on n-type InN layer

L. S. CHUAH1,* , Z. HASSAN1, H. ABU HASSAN1

Affiliation

  1. Nano-Optoelectronics Research and Technology Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Penang, Malaysia

Abstract

In this work, the structure of the InN films has been determined by means of conventional XRD phase analysis ω/2θ scan. Characteristics of the as-deposited (Ni, Ag, and Ni/Ag) metal contact on indium nitride (InN) have been studied. Specific contact resistivity, ρc (SCR) was determined using transmission line method (TLM). The bilayer contact produced the lowest SCR. For this reason, different annealing temperatures (400 °C-700 °C) in nitrogen gas ambient and durations (1-30 minutes) are investigated for Ni/Ag metal contacts, as thermally stable metal-semiconductor contacts are essential for high quality devices. Annealing in nitrogen gas ambient is believed to avoid nitrogen vacancies which act as donors. The electrical behavior of each condition is compared. For relatively different annealing temperatures, substantial difference of the SCR values is observed between different durations samples. Scanning electron microscopy (SEM) measurements were carried out on the as-deposited, and annealed contacts where the surface morphology of each of these conditions was compared.

Keywords

Specific contact resistivity, Indium nitride, Ohmic contact, Annealing.

Citation

L. S. CHUAH, Z. HASSAN, H. ABU HASSAN, Comparative study of characteristics in Ni, Ag and Ni/Ag metal contact schemes on n-type InN layer, Optoelectronics and Advanced Materials - Rapid Communications, 1, 10, October 2007, pp.523-527 (2007).

Submitted at: Aug. 8, 2007

Accepted at: Aug. 30, 2007