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An enhanced bridging model for evaluating the failure probability of anisotropic conductive film packages

C.-M. LIN1,* , C.-M. TAN2, Y.-C. LIU1, C.-Y. CHU2

Affiliation

  1. Graduate School of Opto-Mechatronics and Materials, WuFeng Institute of Technology, Chia-Yi, Taiwan, R.O.C.
  2. Department of Mechanical Engineering, WuFeng Institute of Technology, Chia-Yi, Taiwan, R.O.C

Abstract

This paper develops a computational model for predicting the failure probability of flip chip packages fabricated using anisotropic conductive film (ACF). In the proposed approach, the opening failure probability is evaluated using a conventional Poisson function and the bridging failure probability is estimated using an enhanced box model which takes account of bridging along all the conductive, linear paths between adjacent pads. The opening and bridging probabilities are computed as a function of the volume fraction of the conductive particles within the ACF compound and are plotted in the form of a V-shaped curve, in which the tip value indicates the optimal volume fraction, i.e. the volume fraction which minimizes the overall package failure probability. The computational results indicate that the enhanced bridging model developed in this study provides more logical estimates of the minimum failure probability and optimal volume fraction than the existing bridging models presented in the literature..

Keywords

ACF, Packaging, Bridging, Yield; Failure, Probability.

Citation

C.-M. LIN, C.-M. TAN, Y.-C. LIU, C.-Y. CHU, An enhanced bridging model for evaluating the failure probability of anisotropic conductive film packages, Optoelectronics and Advanced Materials - Rapid Communications, 3, 5, May 2009, pp.493-500 (2009).

Submitted at: May 20, 2009

Accepted at: May 25, 2009