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Mechanical properties of nanostructured copper/hydrogenated amorphous carbon multilayer films grown in a low base vacuum system

N. DWIVEDI1,2, S. KUMAR1,* , D. KAUR2, C. M. S. RAUTHAN1, O. S. PANWAR1

Affiliation

  1. Plasma Processed Materials Group, National Physical Laboratory (CSIR), New Delhi, India-110012
  2. Department of Physics and Centre of Nanotechnology, Indian Institute of Technology, Roorkee, India-247667

Abstract

Nanostructured copper/hydrogenated amorphous carbon (Cu/a-C:H) multilayer films have been deposited in a low base vacuum system (base pressure 1x10-3 Torr) and studied for their mechanical properties. The analysis shows very low residual stress (below 1 GPa), moderate nanohardness (H) and elastic modulus (E) of the resultant films. Further these films have been studied for their plastic deformation energy and elastic recovery. Atomic force microscopic analysis reveals the nanostructured morphology and low surface roughnesses of the resultant films. Estimated roughnesses values have also been correlated with the experimental measured H values. The presence of Cu in these structures have been confirmed by time of flight-secondary ion mass spectroscopy, X-ray photoelectron spectroscopy and energy dispersive Xray analysis..

Keywords

Copper/hydrogenated amorphous carbon multilayer, Nanostructure, Nanohardness, Surface roughness.

Citation

N. DWIVEDI, S. KUMAR, D. KAUR, C. M. S. RAUTHAN, O. S. PANWAR, Mechanical properties of nanostructured copper/hydrogenated amorphous carbon multilayer films grown in a low base vacuum system, Optoelectronics and Advanced Materials - Rapid Communications, 4, 4, April 2010, pp.604-609 (2010).

Submitted at: March 29, 2010

Accepted at: April 11, 2010