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F. ILIE1,* , C. TITA2
Nanoparticles have been widely used in polish slurries such as those in the Chemical Mechanical Polishing (CMP) process. For understanding the mechanisms of CMP, an Atomic Force Microscope (AFM) is used to characterize polished surfaces after a set of polishing experiments. To optimize the CMP polishing process, one needs to get information on the interaction between the abrasive slurry particles and the surface being polished. CMP slurry of the solid surfaces is slurry with large particle size colloidal silica nanoabrasive. Silica sol nanoabrasives with large particle are prepared and characterized by Transmission Electron Microscopy (TEM), Particles Colloidal Size (PCS) and Zeta potential in this paper. Results show that the silica sol nanoabrasives about 100 nm are of higher stability (Zeta potential is -65 mV) and narrow distribution of particle size. Then alkali CMP slurries for the solid surfaces containing self-made silica sol nanoabrasives are prepared and applied. The movement of nanoparticles in liquid and the interaction between nanoparticles and solid surfaces are very important to obtain an atomic alloy smooth surface in the CMP process. We investigate the nanoparticle adhesion and removal processes during CMP and post-CMP cleaning. The mechanical interaction between particles and the wafer surface was studied using a microcontact wear model. This model considers the particle effects between the polishing interfaces during load balancing. Experimental results on polishing and cleaning are compared with numerical analysis. This paper suggests that during post-CMP cleaning, a combined effort in chemical and mechanical interaction (tribochemical interactions) would be effective in removal of small particles during cleaning. For large particles, more mechanical forces would be more effective. CMP results show that the removal rate has been improved to 367 nm/min and RMS of roughness has been reduced.
CMP, Nanoparticle adhesion, Substrate surface, Colloidal silica, Polish slurry.
F. ILIE, C. TITA, Interaction between nanoparticles during chemical mechanical polishing (CMP), Optoelectronics and Advanced Materials - Rapid Communications, 3, 3, March 2009, pp.245-248 (2009).
Submitted at: Feb. 20, 2009
Accepted at: March 19, 2009
Optoelectronics and Advanced Materials - Rapid Communications
(2025): Impact Factor = 0.5 - Journal Citation Reports (Clarivate Analytics, 2026)
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